Soldering Solutions

Components and systems for soldering automation

Robot soldering in electronics manufacturing, methods and processes

Not all solder joints that occur in electronics manufacturing can be made using automated mass soldering processes, such as reflow or wave soldering. The characteristic feature of all these connections is that they have to be soldered individually - and this is usually still done manually. The consequence: significantly higher costs and quality that depends on the employees' daily form. But even such work can now be automated. Here are a few examples:

Special solder joints

e.g. a connector on a mounted SMD circuit board

Special solder joints Reel to reel production

Reel to reel manufacturing

e.g. capacitor on leadframe or flex (FFC)

Few solder joints on the product

e.g. cable on PCB or ceramic substrate

Few solder joints Temperature sensitive substrates

Temperature sensitive substrates

e.g. LEDs on Flex (PEN/PET)

Solder joints caused by assembly process

Solder joints caused by the assembly process

e.g. a completely soldered board that has to be soldered on the two connection pins of a coil without reflowing the existing solder joints.

Soldering processes for robot soldering

To solve a wide variety of requirements, ATN provides a range of soldering processes to choose from:

Light soldering with the patented LightBeam light soldering system is particularly suitable for selective reflow soldering.
Contacts mounted in plastic housings are often soldered with the automated soldering iron and solder wire.
With microflame and induction soldering, ATN offers two non-contact soldering processes, which are characterized above all by uniform heating, especially on solid components
Ultra-fine and micro soldering is realized with the focused beam of a high-power diode laser.
Solder wireSolder pasteSolder depositsPreforms
  • contactless
  • robust process
  • black plastic parts must be covered
  • contactless
  • suitable for fine soldering
  • flexible applicable
  • possible without process control
  • camera can be integrated in beam path
  • safety-related effort
  • high demands on geometry and positioning of parts
  • non-contact heating/li>
  • high energy density and fast heating with hold-down soldering under bias voltage possible
  • sensitive electronic components can be damaged by RF field
  • high effort for water cooling
  • inexpensive
  • adjustable maximum temperature "known" from manual production
  • scaling of soldering tips
  • wear of soldering tips
  • high maintenance and support effort
  • contactless
  • no direct heating of the solder possible
  • flame cannot be switched off
General terms and conditions (PDF)

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